[1]王聰*,孫瑩,王蕾.反常熱膨脹功能材料的研究進(jìn)展[J].中國(guó)材料進(jìn)展,2015,(7-8):021-25.[doi:10.7502/j.issn.1674-3962.2015.07.01]
Wang Cong*,Sun Ying,Wang Lei.Progress on Abnormal Thermal Expansion Materials[J].MATERIALS CHINA,2015,(7-8):021-25.[doi:10.7502/j.issn.1674-3962.2015.07.01]
點(diǎn)擊復(fù)制
反常熱膨脹功能材料的研究進(jìn)展(
)
中國(guó)材料進(jìn)展[ISSN:1674-3962/CN:61-1473/TG]
- 卷:
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- 期數(shù):
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2015年第7-8期
- 頁(yè)碼:
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021-25
- 欄目:
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特約研究論文
- 出版日期:
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2015-08-18
文章信息/Info
- Title:
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Progress on Abnormal Thermal Expansion Materials
- 作者:
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王聰*; 孫瑩; 王蕾
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北京航空航天大學(xué)物理學(xué)院,凝聚態(tài)物理與材料物理研究中心
- Author(s):
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Wang Cong*; Sun Ying; Wang Lei
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Center for Condensed Matter and Materials Physics, Department of Physics, Beihang University
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- 關(guān)鍵詞:
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反常負(fù)熱膨脹; 功能材料
- DOI:
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10.7502/j.issn.1674-3962.2015.07.01
- 文獻(xiàn)標(biāo)志碼:
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A
- 摘要:
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固體材料通常會(huì)隨溫度變化產(chǎn)生膨脹或收縮行為,然而,材料的熱脹冷縮會(huì)降低精密部件的結(jié)構(gòu)穩(wěn)定性和安全可靠性,甚至破壞材料的功能特性。在光學(xué)儀器、微電子器件、航空航天等高技術(shù)領(lǐng)域,我們迫切需要形狀和尺寸不隨溫度變化的材料,以保證其構(gòu)件具有高的尺寸穩(wěn)定性、精密性和長(zhǎng)的使用壽命,因此,低(近零)熱膨脹材料的研究日益受到重視。本文概述了反常(負(fù)或近零)熱膨脹材料的研究與發(fā)展歷程,主要針對(duì)目前國(guó)內(nèi)外研究較多的幾類(lèi)負(fù)熱膨脹體系的研究工作做了論述,并探討了該研究領(lǐng)域仍存在的問(wèn)題以及未來(lái)可能的發(fā)展方向。
- Abstract:
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Solid materials usually show expansion or contraction behavior in response to changes in temperature. However, thermal expansion behavior always reduces the stability and safe reliability of precision parts, and even destroys the functional features of the materials. In the field of optical instruments, microelectronic devices, aerospace and others, we desperately need the materials for which the shape and size keep unchanged with temperature, in order to ensure high dimensional stability, precision and long service life. Therefore, the research on the low or near zero thermal expansion materials has attracted more and more attention. This paper outlines the research and development of abnormal (negative or near zero) thermal expansion materials, especially, focusing on several popular classes in this system. We further discussed the existent problems and the direction of future development in this research field.
更新日期/Last Update:
2015-06-29