文章信息/Info

Title:

Quantitative Evaluation on Interface Bonding of Layered Materials with Thin Cladding Layer

作者:

李 龍; 周德敬

銀邦金屬?gòu)?fù)合材料股份有限公司 江蘇省金屬層狀復(fù)合材料重點(diǎn)實(shí)驗(yàn)室

Author(s):

LI Long;  ZHOU Dejing

Yin Bang Clad Material Co.,Ltd., Jiangsu Province Key Laboratory for Clad Materials

關(guān)鍵詞:

層狀復(fù)合材料; 薄復(fù)層; 界面結(jié)合; 定量評(píng)價(jià)方法

DOI:

10.7502/j.issn.1674-3962.2016.11.08

文獻(xiàn)標(biāo)志碼:

A

摘要:

主要針對(duì)復(fù)層厚度較薄的（如小于0��5 mm）的層狀復(fù)合材料界面結(jié)合的定量評(píng)價(jià)實(shí)驗(yàn)方法進(jìn)行了回顧和總結(jié)，評(píng)述了各種方法的優(yōu)缺點(diǎn)并分析了各種方法的適用條件和應(yīng)用范圍。隨著計(jì)算機(jī)技術(shù)水平的不斷提高，有限元數(shù)值模擬技術(shù)在層狀復(fù)合材料結(jié)合性能的評(píng)價(jià)分析中起到了越來(lái)越重要的指導(dǎo)作用。隨著人們對(duì)層狀復(fù)合材料界面結(jié)合認(rèn)識(shí)的逐漸深入以及新的分析評(píng)價(jià)技術(shù)手段的不斷涌現(xiàn)，層狀復(fù)合材料界面結(jié)合性能檢測(cè)的精度將不斷提高，理論模型會(huì)不斷完善，層狀復(fù)合材料界面結(jié)合的評(píng)價(jià)也會(huì)逐漸向定量準(zhǔn)確、容易解析、無(wú)損檢測(cè)、易于實(shí)現(xiàn)自動(dòng)化和標(biāo)準(zhǔn)化的方向發(fā)展。

Abstract:

This paper briefly offers various methods of quantitatively evaluating the bonding quality of layered materials with cladding layer thickness less than 0��5 mm. Each evaluation method has its advantage, disadvantage and applicable conditions and scopes. As the continuous improvement of computer technology, finite element numerical simulation technology has played a more and more important role in analysis of evaluating interface bonding of layered materials. With the deepening understanding of interface and along with the advance of other technologies, testing accuracy and theoretical models will continuously be improved. In the future, the interface bonding evaluation will gradually move forward to quantitative,nondestructive, easy to realize automation and standardization direction.