文章信息/Info

Title:

Development Status and Prospects of High-Tc Superconducting Magnetic Bearing

作者:

許吉敏; 張 飛; 金英澤; 張 帆; 袁小陽

西安交通大學現代設計及轉子軸承系統教育部重點實驗室

Author(s):

XU Jimin; ZHANG Fei; JIN Yingze; Zhang Fan; YUAN Xiaoyang

Key Laboratory of Education Ministry for Modern Design and Rotor-Bearing System, Xi’an Jiaotong University

關鍵詞:

釘扎; 無源自穩(wěn)定; 高溫超導磁懸浮軸承; 發(fā)展現狀; 應用前景

Keywords:

Pinning;  passive self-stability;  HTSMB;  development status;  application prospects

DOI:

10.7502/j.issn.1674-3962.2017.05.01

文獻標志碼:

A

摘要:

第二類高溫超導體的磁通釘扎效應使得超導體在外加磁場中無需主動控制而能穩(wěn)定懸浮。利用這種無源自穩(wěn)定懸浮特性，高溫超導磁懸浮軸承可以實現部件之間無機械摩擦的高速相對運動，在旋轉機械、飛輪儲能和交通運輸等方面展現出了良好的應用前景。近年來，高溫超導磁懸浮軸承的發(fā)展在世界范圍內取得了令人矚目的成就，軸承的設計思想、結構和應用環(huán)境都得到了相應的拓展。本文從結構特征角度綜述了近年來國內外超導磁懸浮軸承樣機的發(fā)展現狀，重點介紹了西安交通大學的超導磁液復合軸承結構及其在液體火箭中的應用方案。結合現狀探討了超導磁懸浮軸承有待研究的問題和應用前景，指出超導軸承應向復合支撐方向發(fā)展以利于推進應用。

Abstract:

Pinning effect of flux in type II high temperature superconductor (HTS) can make superconductor be stably suspended in external magnetic field without active controlling. By adopting this passive self-stability, high temperature superconducting magnetic bearing (HTSMB) can realize the high speed relative motion between parts without mechanical friction. HTSMB has been demonstrated fascinating application prospects in rotating machinery, flywheel energy storage system, transportation system and etc. During the past years, the development of HTSMB has made remarkable achievements worldwide. Design ideas, structures and application environments of HTSMB have been expanded accordingly. This paper summarizes typical HTSMB prototypes from the perspective of structural features. A kind of superconducting compound bearing proposed by Xi’an Jiaotong University and its application scheme in liquid rocket are introduced specially. This novel bearing is a combination of HTSMB and fluid film bearing. Based on the development status, issues to be studied and application prospects of HTSMB are discussed. This paper points out that HTSMB should be developed to compound bearing to advance the application process.