文章信息/Info

Title:

 esearch Status and Progress of Soft Materials：A Review

作者:

孫建宇; 王永泉; 朱伯韜; 朱良全

西安交通大學機械工程學院，陜西 西安 710049

Author(s):

SUN Jianyu; WANG Yongquan; ZHU Botao; ZHU Liangquan

School of Mechanical Engineering，Xi’an Jiaotong University，Xi’an 710049，China

關(guān)鍵詞:

軟體材料; 聚氨酯; 水凝膠; 電活性聚合物; 形狀記憶聚合物

Keywords:

soft materials;  polyurethanes;  hydrogels;  electroactive polymers;  shape memory polymers

DOI:

10.7502/j.issn.1674-3962.2018.10.05

文獻標志碼:

A

摘要:

軟體材料（楊氏模量通常在104~109 Pa之間）普遍具有弱影響引發(fā)強響應(yīng)的基本特征。軟體材料的范圍十分廣泛，有以橡膠、液晶等為代表的業(yè)已高度產(chǎn)業(yè)化應(yīng)用的傳統(tǒng)軟體材料，也有以智能凝膠、電活性聚合物、形狀記憶聚合物等為代表的智能軟體材料。后者獨特的刺激敏感特性使其在軟體機器人、軟體電子、生物醫(yī)療、航空航天等領(lǐng)域擁有廣闊應(yīng)用前景。本文面向工程科技前沿，首先介紹了可降解聚氨酯、水凝膠等的材料特性、制備工藝及其在生物醫(yī)療領(lǐng)域（如藥物定向釋放和組織工程）的應(yīng)用，隨后重點對以離子聚合物-金屬復(fù)合材料（IPMC）和介電彈性體（DE）為代表的電活性聚合物（EAP），以及形狀記憶聚合物（SMP）的基本特性與研究進展進行了梳理和介紹和。最后分析了軟體材料產(chǎn)業(yè)化應(yīng)用所面臨的問題，展望了智能軟體材料與增材制造技術(shù)相結(jié)合的4D打印技術(shù)的發(fā)展趨勢。

Abstract:

Soft materials, whose Young’s modulus typically scatters between 104 and 109 Pa, have the basic characteristic that they may strongly respond to weak stimuli. The range of soft materials is so wide: not only those traditional soft materials such as rubber and liquid crystal which have been highly industrialized, but smart soft materials represented by smart gel, EAP (electroactive polymers) and SMP (shape memory polymers), etc. The special stimuli-response properties make the latter ones have broad application prospects in many significant fields, e.g., soft robotics, soft electronics, biomedical engineering, and aerospace. Focusing on the frontiers of engineering technology, this paper firstly gives brief introductions about the material properties and preparation processes of the two kinds of traditional materials, i.e., biodegradable polyurethanes and hydrogels, with emphasis on their applications in biomedicines such as targeted drug release and tissue engineering. Then, the EAPs, represented by Ionic Polymer-Metal Composites (IPMC) and Dielectric Elastomers (DE), as well as SMPs, are highlighted by the presentation and analysis for their basic characteristics and state-of-the-art applications. Finally, the problems faced in engineering applications of soft materials are analyzed, and the trend of 4D printing technology combining soft materials with additive manufacturing is prospected.