[1]張荻,譚占秋,熊定邦,等.熱管理用金屬基復(fù)合材料的應(yīng)用現(xiàn)狀及發(fā)展趨勢[J].中國材料進展,2018,(12):026-30.[doi:10.7502/j.issn.1674-3962.2018.12.06]
ZHANG Di,TAN Zhanqiu,XIONG Ding-Bang,et al.Application and Prospect of Metal Matrix Composites for Thermal Management: an Overview[J].MATERIALS CHINA,2018,(12):026-30.[doi:10.7502/j.issn.1674-3962.2018.12.06]
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熱管理用金屬基復(fù)合材料的應(yīng)用現(xiàn)狀及發(fā)展趨勢(
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中國材料進展[ISSN:1674-3962/CN:61-1473/TG]
- 卷:
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- 期數(shù):
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2018年第12期
- 頁碼:
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026-30
- 欄目:
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- 出版日期:
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2018-12-31
文章信息/Info
- Title:
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Application and Prospect of Metal Matrix Composites for Thermal Management: an Overview
- 作者:
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張荻; 譚占秋; 熊定邦; 李志強
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上海交通大學(xué)，材料科學(xué)與工程學(xué)院，金屬基復(fù)合材料國家重點實驗室
- Author(s):
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ZHANG Di; TAN Zhanqiu; XIONG Ding-Bang; LI Zhiqiang
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State Key Laboratory of Metal Matrix Composites, School of Materials Science and Engineering, Shanghai Jiao Tong University
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- 關(guān)鍵詞:
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金屬基復(fù)合材料; 熱管理; 熱膨脹系數(shù); 熱導(dǎo)率
- Keywords:
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metal matrix composites (MMCs); thermal managements; coefficient of thermal expansion; thermal conductivity
- DOI:
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10.7502/j.issn.1674-3962.2018.12.06
- 文獻標志碼:
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A
- 摘要:
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從不同種類金屬基復(fù)合材料的性能特點、國內(nèi)外主流企業(yè)與主要產(chǎn)品、典型熱管理應(yīng)用等幾方面，綜述了近年來金屬基復(fù)合材料在熱管理領(lǐng)域的實際應(yīng)用現(xiàn)狀，并展望了金屬基復(fù)合材料在應(yīng)對未來高功率密度熱管理需求的發(fā)展方向�；诟邔�(dǎo)熱、低膨脹的共性特征，硅/鋁、碳化硅/鋁、碳纖維/鋁等鋁基復(fù)合材料以輕質(zhì)、低成本、可加工的性能優(yōu)勢，在航空航天、交通運輸領(lǐng)域得到了廣泛應(yīng)用；而碳纖維、碳化硅、金剛石等增強銅基復(fù)合材料則憑其高的環(huán)境耐受性和穩(wěn)定性，在軍事國防領(lǐng)域逐漸嶄露頭角。針對電子器件功率密度持續(xù)攀高，國家重點研發(fā)計劃已立項專門開展超高熱導(dǎo)率（≥800W/mK）金屬基復(fù)合材料研制，納米尺度復(fù)合界面改性設(shè)計、新型復(fù)合構(gòu)型化及超高導(dǎo)熱增強體的發(fā)現(xiàn)發(fā)展，可能引領(lǐng)熱管理領(lǐng)域新的研究熱點。
- Abstract:
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The thermal performances and characteristics, products from main companies at home and abroad, and examples of typical thermal management applications of different metal matrix composites (MMCs) were reviewed. The possible future developments of MMCs used for thermal managements of high power density were predicted. Based on the common characteristics of high thermal conductivity and low coefficient of thermal expansion, silicon/aluminum, silicon carbide/aluminum and carbon fiber/aluminum composites, featured of light weight, low cost and machinability, have been widely used in the areas of aerospace, aviation and transportation. Carbon fiber, silicon carbide, diamond particles reinforced copper composites were also gradually emerging in the of military fields, due to their high environmental tolerance and stability. As responses to electronic packaging with ever increasing power density, the National Key Research & Development Plan has been dedicated to carry out projects focusing on MMCs with ultrahigh thermal conductivity over 800 W/mK. It’s supposed that, nanoscale interface design, novel architecture and new reinforcements with ultrahigh thermal conductivity, may lead to new popular studies in MMCs for thermal management applications.
備注/Memo
- 備注/Memo:
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收稿日期：2018-6-15
基金項目：國家重點研發(fā)計劃資助項目（Nos. 2017YFB0406100，2017YFB0406200）; 國家自然科學(xué)基金項目（No. 51401123）
第一作者：張荻，男，1957年生，教授，博士生導(dǎo)師
通訊作者：張荻，男，1957年生，教授，博士生導(dǎo)師，Email：zhangdi@sjtu.edu.cn；
? ? ? ? ? ? ? ? ? 李志強，男，1973年生，教授，博士生導(dǎo)師，Email：lizhq@sjtu.edu.cn
更新日期/Last Update:
2018-11-30