文章信息/Info

Title:

Research Progress on Polymer Assisted Metal Deposition

文章編號:

1674-3962(2022)08-0589-12

作者:

趙治; 王悅; 田坤卉; 單宇鵬; 宋曉艷

（北京工業(yè)大學 材料與制造學部 新型功能材料教育部重點實驗室，北京 100124）

Author(s):

ZHAO Zhi;  WANG Yue;  TIAN Kunhui;  SHAN Yupeng;  SONG Xiaoyan

(Key Laboratory of Advanced Functional Materials, Ministry of Education, Faculty of Materials and Manufacturing, Beijing University of Technology, Beijing 100124, China)

關鍵詞:

金屬沉積; 高分子; 理化性質(zhì); 表面修飾; 導電材料

Keywords:

metal deposition;  polymer;  physical and chemical properties;  surface modification;  conductive materials

分類號:

TQ316.6

DOI:

10.7502/j.issn.1674-3962.202201009

文獻標志碼:

A

摘要:

金屬沉積在制備功能材料與器件的過程中扮演了重要角色。傳統(tǒng)金屬沉積技術在材料兼容性與工作條件要求上存在很大的局限，無法滿足現(xiàn)代制造業(yè)的需求。高分子輔助金屬沉積利用高分子獨特的理化性質(zhì)調(diào)控金屬沉積，反應條件溫和，適用材料體系廣泛，且對產(chǎn)物的組成分布與空間結構都有很好的控制能力�；�于這一方法，研究者們制備了多種功能金屬結構材料與金屬-高分子復合材料，并將其應用于可穿戴柔性設備、能量儲存與轉(zhuǎn)化設備、電信號傳感器等領域，獲得了巨大成果。對上述工作進行了詳細的綜述，從高分子的物理與化學特性兩方面系統(tǒng)闡述了高分子調(diào)控金屬沉積的機理，并對具有代表性的高分子輔助金屬沉積模式與應用進行了舉例說明,最后

Abstract:

Metal deposition plays a critical role in the fabrication of functional materials and devices. Conventional metal deposition techniques have significant limits on their compatibility with materials and required working conditions, which cannot satisfy the demands of modern manufacturing. Polymer assisted metal deposition takes advantage of the unique physical and chemical properties of polymers to modulate metal deposition, which features mild working conditions, great compatibility with various materials, as well as the ability to tune products�� composition and structure. Base on this approach, researchers have obtained a number of functional metallic units and metal-polymer composites, which lead tremendous achievements in the field of wearable soft electronics, energy conversion and storage devices, and electrical sensors. The present work contains a detailed review on the above work and elucidates the physical/chemical mechanism of polymer mediated metal deposition. Examples on representative polymer assisted metal deposition approaches and their applications are introduced. A perspective is provided at the end of this review on the potential developments of this field in the near future.